US Patent 7578909 - CNT sputtering apparatus
http://www.freepatentsonline.com/7578909.html
Sputtering is a common technique used in the semiconductor industry in forming metal or metal oxide thin film structures. This patent from Hitachi Cable teaches a way to integrate carbon nanotubes into the sputtering apparatus. Claim 10 reads:
10. A sputtering apparatus, comprising:
a sputtering target material, comprising: a molded material, comprising: a metal material; and a carbon nanotube (CNT) mixed into the metal material.
Sputtering is a common technique used in the semiconductor industry in forming metal or metal oxide thin film structures. This patent from Hitachi Cable teaches a way to integrate carbon nanotubes into the sputtering apparatus. Claim 10 reads:
10. A sputtering apparatus, comprising:
a sputtering target material, comprising: a molded material, comprising: a metal material; and a carbon nanotube (CNT) mixed into the metal material.
Labels: Hitachi Cable
posted by blaisemouttet at 9:23 PM
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