US Patent 7476982 - Electrically conductive nanofiber adhesive
US Patent 7,476,982
This patent from the Regents of the University of California teaches a potential replacement for solder based IC connection in the form of nanofibers that could help eliminate problems of thermal mismatch during packaging which result in integrated circuit malfunction. Claim 1 reads:
1. An integrated circuit chip comprising:
a chip surface;
one or more contact pads disposed on the chip surface; and
one or more electrically conductive nano-fibers formed on the one or more contact pads, the one or more electrically conductive nano-fibers configured to provide an adhesive force by intermolecular forces and establish an electrical connection with one or more contact pads disposed on the surface of a chip package.
This patent from the Regents of the University of California teaches a potential replacement for solder based IC connection in the form of nanofibers that could help eliminate problems of thermal mismatch during packaging which result in integrated circuit malfunction. Claim 1 reads:
1. An integrated circuit chip comprising:
a chip surface;
one or more contact pads disposed on the chip surface; and
one or more electrically conductive nano-fibers formed on the one or more contact pads, the one or more electrically conductive nano-fibers configured to provide an adhesive force by intermolecular forces and establish an electrical connection with one or more contact pads disposed on the surface of a chip package.
Labels: University of California
posted by blaisemouttet at 4:55 PM
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